03/08/2026
From Chips to Systems: Powering Consumer Electronics & AR/VR Innovation at IICIE 2026
From smartphones to AR/VR headsets, from wearables to smart home devices – consumer electronics innovation is built on three critical layers: chips that compute, optics that see and display, and embedded systems that connect and control.
IICIE 2026, the premier platform for the entire semiconductor ecosystem, will co-locate with the 27th China International Optoelectronic Exposition (CIOE 2026) and Shenzhen International Electronics & Embedded Expo (elexcon 2026).
🔍The three co-located shows deliver comprehensive coverage across all three technology layers:
🟩Photonics & Optics | CIOE Optical materials and components, optical lenses and modules, 3D visions, LiDAR, spectral sensing, Micro LEDs, silicon-based OLEDs, microdisplays, optical waveguides, AR/VR all-in-one devices, and more.
🟦Semiconductors | IICIE Core integrated circuit products including AI computing chips, main controller SoCs, Bluetooth BLE RF chips, PMICs, and application‑specific AI processors.
🟧 Embedded Electronics | elexcon Electronic hardware and systems spanning electronic components, memory chips and modules, power semiconductors, power solutions, edge‑embedded AI, connectors, and other foundational hardware, completing the underlying supply chain for end‑user products.
👉 View more: https://iicieexpo.com/email/2026/edm/20260731_IICIE_EN/20260731_IICIE_EN.html
👉 Get Your Free Pass: https://reg.iicieexpo.com/se-en/index.html?ly=EN-SocialMedia2026-VP-3ShowsConElec-0803-FB